Assembly Equipment

Assembly Equipment

Manufacturer Modell Description More
Alphasem DB 608-PRL Bonder Details
Datacon 2220 APM Multichip Diebonder Details
Datacon 2200 APM Die Bonder Details
Delvotec 4500 Die Bonder Details
Delvotec 6400 Wirebonder Details
Disco 8" Wafer Ring Frame Details
ESEC 3088 Gold Ballbonder Details
ESEC 3018 Gold Ballbonder Details
EVG 520 Manual wafer load substrate bonder Details
Hesse Mechatronics Indexersystem Details
K & S 4129 Deep-Access-Bonding Details

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