Assembly Equipment
Assembly Equipment
Manufacturer | Modell | Description | More |
---|---|---|---|
Alphasem | DB 608-PRL | Bonder | Details |
Datacon | 2200 APM | Die Bonder | Details |
delvotec | 6200 | Goldball Wirebonder | Details |
Delvotec/Siemens | 4500/Sieplace A2 | Die Bonder | Details |
Disco | DAD 3220 | Dicing Saw Disco DAD 3220 | Details |
ESEC | 3088 | Gold Ballbonder | Details |
ESEC | 3018 | Gold Ballbonder | Details |
ESI | 6150 | Laser Trimmer | Details |
EVG | 520 | Manual wafer load substrate bonder | Details |
Hesse Mechatronics | Indexersystem | Details | |
K & S | 4129 | Deep-Access-Bonding | Details |