Assembly Equipment
Assembly Equipment
Manufacturer | Modell | Description | More |
---|---|---|---|
Alphasem | DB 608-PRL | Bonder | Details |
Alphasem | E8001 | DieSort System | Details |
Datacon | 2220 APM | Multichip Diebonder | Details |
Delvotec | 4500 | Die Bonder | Details |
Delvotec | 6400 | Wirebonder | Details |
Disco | DFL 7161 | Laser Saw | Details |
ESEC | 3088 | Gold Ballbonder | Details |
ESEC | 3018 | Gold Ballbonder | Details |
EVG | 520 | Manual wafer load substrate bonder | Details |
Hesse Mechatronics | Indexersystem | Details | |
K & S | 4129 | Deep-Access-Bonding | Details |