Assembly Equipment

Assembly Equipment

Manufacturer Modell Description More
Alphasem DB 608-PRL Bonder Details
ASM ASM AS899 Die Bonder Details
Datacon 2200 APM Die Bonder Details
Delvotec 4500 Die Bonder Details
ESEC 3088 Gold Ballbonder Details
ESEC 3018 Gold Ballbonder Details
ESI 6150 Laser Trimmer Details
EVG 520 Manual wafer load substrate bonder Details
Hesse Mechatronics Indexersystem Details
K & S 4129 Deep-Access-Bonding Details

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