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Tel: +49 / 361 421 17 02
Fax: +49/ 361 421 17 11
E-Mail: info@khs-semi.com
KHS und Partner
Gustav-Tauschek-Str.7
99099 Erfurt/Germany
Assembly Equipment
Assembly Equipment
| Manufacturer | Modell | Description | More |
|---|---|---|---|
| Alphasem | DB 608-PRL | Bonder | Details |
| Datacon | 2220 APM | Multichip Diebonder | Details |
| Datacon | 2200 APM | Die Bonder | Details |
| Delvotec | 4500 | Die Bonder | Details |
| Delvotec | 6400 | Wirebonder | Details |
| Disco | 8" | Wafer Ring Frame | Details |
| ESEC | 3088 | Gold Ballbonder | Details |
| ESEC | 3018 | Gold Ballbonder | Details |
| EVG | 520 | Manual wafer load substrate bonder | Details |
| Hesse Mechatronics | Indexersystem | Details | |
| K & S | 4129 | Deep-Access-Bonding | Details |
